JPS62174345U - - Google Patents
Info
- Publication number
- JPS62174345U JPS62174345U JP6205786U JP6205786U JPS62174345U JP S62174345 U JPS62174345 U JP S62174345U JP 6205786 U JP6205786 U JP 6205786U JP 6205786 U JP6205786 U JP 6205786U JP S62174345 U JPS62174345 U JP S62174345U
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- recess
- circuit board
- hybrid integrated
- membrane circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6205786U JPS62174345U (en]) | 1986-04-24 | 1986-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6205786U JPS62174345U (en]) | 1986-04-24 | 1986-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62174345U true JPS62174345U (en]) | 1987-11-05 |
Family
ID=30895966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6205786U Pending JPS62174345U (en]) | 1986-04-24 | 1986-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174345U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01138742A (ja) * | 1987-11-26 | 1989-05-31 | Hitachi Ltd | 半導体集積回路モジュール |
| JP2009141250A (ja) * | 2007-12-10 | 2009-06-25 | Hitachi Kokusai Electric Inc | 電子部品の熱伝達構造 |
-
1986
- 1986-04-24 JP JP6205786U patent/JPS62174345U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01138742A (ja) * | 1987-11-26 | 1989-05-31 | Hitachi Ltd | 半導体集積回路モジュール |
| JP2009141250A (ja) * | 2007-12-10 | 2009-06-25 | Hitachi Kokusai Electric Inc | 電子部品の熱伝達構造 |